STORY 9: "Flow and Reflow"

Good morning.

Good morning, Hikaru. Have you become accustomed to the company?

Yes, I've become fairly accustomed to it.

I'm so glad to hear that.
By the way, I'll talk about various soldering methods today.

Soldering methods called "Reflow" and "Flow" that you mentioned before?

Yes. You have a good memory.
The number of electronic components used for P.W.B.s in electric products is very large. If these components are soldered one at a time, it takes a lot of time and the soldering cost is staggeringly high. Furthermore, labor of soldering workers who handle so many components is very large.

These seems somewhat interesting.

Making a single product may be interesting, but in the case of mass production, you can't say that.

Yes, you're right.

Today, I'll explain how to solder a large quantity of electronic components simultaneously.

It seems TV shopping or something like that.

That's crazy!

I'm sorry.

You really say a bit too much.
Soldering methods are generally classified into three types: "Iron soldering", "Dip soldering" and "Reflow soldering". You know about "Iron soldering", don't you?

Yes, of course.

The "Dip soldering method" is the method of dipping a target part into melted solder. The target part is directly heated with melted solder. It can be illustrated like this: