| Compact and high performance
soldering system developed for soldering and desoldering components and
connectors mounted on circuit boards. |
|
The solder flow is both temparature
controlled and time controlled.
|
|
Many different nozzle sizes
are available.
|
|
Soldering and desoldering
cycles are automatic and precise. |
|
A built-in locator light pinpoints
are exact position for component placement. |
|
Solder remaining in the through
hole is completely removed by utilizing the air unit. |
 |
Impeller and Chamber which
are eroded by lead-free solder the most strongly are covered by special
plating. |