FINAL STORY: Soldering Iron Forever
All electronic components cannot be subjected to reflow soldering or flow soldering.
What do you mean?
For example, in the case of reflow soldering, since the whole solder is heated, the temperature of the target component will increase, as a matter of course. Also, in case of flow soldering, the component temperature may increase because the component touches melted solder. Therefore, these methods cannot be used to mount components with low heat resistance.
Soldering irons are necessary to solder such components.
That's right. After the reflow or flow soldering process is finished, the components are soldered. In addition to this, tall components and those that cannot undergo reflow or flow soldering for any reason must be soldered later.
But, this problem has been reduced by component manufacturers' efforts and modification in P.W.B. design.
In addition to this, P.W.B. repair work also requires a soldering iron. For example, if a bridge occurs in the reflow or flow soldering process, the bridge must be corrected with a soldering iron. We cannot discard the P.W.B. because of the bridge.
If the component mounted to a P.W.B. is defective, we must remove the defective component, and re-mount a new component to the P.W.B. Even if the technology rapidly advances, it is still difficult to eliminate defects.
Is that right? Well, soldering irons are still required from now on, I suppose.
But, the specifications demanded on soldering irons have become more severe, and will become even more severe in the future.