 |
| Mr.Yokoo |
: |
All electronic components cannot
be subjected to reflow soldering or flow soldering. |
| Hikaru | : |
What do you mean? |
| Mr.Yokoo | : |
For example, in the case of
reflow soldering, since the whole solder is
heated, the temperature of the target component
will increase, as a matter of course. Also,
in case of flow soldering, the component temperature
may increase because the component touches
melted solder. Therefore, these methods cannot
be used to mount components with low heat
resistance. |
| Hikaru |
: |
Soldering irons are necessary
to solder such components. |
|
| Mr.Yokoo | : |
That's right.
After the reflow or flow soldering process
is finished, the components are soldered.
In addition to this, tall components and those
that cannot undergo reflow or flow soldering
for any reason must be soldered later. |
| Hikaru | : |
I see. |
| Mr.Yokoo | : |
But, this problem has been
reduced by component manufacturers' efforts
and modification in P.W.B. design.
In addition to this, P.W.B. repair work also
requires a soldering iron. For example, if
a bridge occurs in the reflow or flow soldering
process, the bridge must be corrected with
a soldering iron. We cannot discard the P.W.B.
because of the bridge.
If the component mounted to a P.W.B. is defective,
we must remove the defective component, and
re-mount a new component to the P.W.B. Even
if the technology rapidly advances, it is
still difficult to eliminate defects. |
| Hikaru | : |
Is that right? Well, soldering
irons are still required from now on, I suppose.
|
| Mr.Yokoo |
: |
But, the specifications demanded
on soldering irons have become more severe,
and will become even more severe in the future.
|
| Hikaru | : |
Why? |
|
|
|
|
