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How to use Shape BCM/CM and examples

In Shape BCM/CM, surface tension of solder in the hollow section:

Type BC Type BCM
  • Enables bridging to be corrected;

When the tip is placed, solder left in a hollow section absorbs solder in the bridge section.
Please use this shape if solder amount of the bridge is small.
* If solder amount of the bridge is large, Shape J, K and H are recommended. For further details, see the “Correcting Bridging”

  • Prevents bridging from occurring when drag soldering;

Since the pulling force due to surface tension of this type is stronger than that of Shape BC, solder is not left in unnecessary areas during drag soldering.

 Shape BCM and CM are not available for sale or use in the U.S.A.

Drag soldering

Use it for drag soldering.

Feed solder on a hollow section and drag the tip along slowly.

Apply flux to leads and land pads before soldering. It prevents the troubles such as solder bridge.


See the movie for further details,

Correcting Bridging

Use it for correcting Bridging.
1. Clean solder left in the hollow section by a cleaning sponge, etc.

A small amount of solder may be left in the hollow section.

2. Put the tip on the bridge section and drag it.

See the movie for further details,

Put the hollowed surface on the bridge section. Put the hollowed surface on the bridge section.