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Auto-Soldering System/Auto-Soldering Robot System
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Even without specialized robot knowledge, soldering programs can be created easily using a tablet PC and joystick.
For soldering points arranged at regular intervals, such as connectors, programming is possible simply by entering the travel distance and number of positions with sequential repositioning.
When working with multiple identical boards, programming can be done simply by entering the offset from the original position.
The TreeView function enables soldering only at the points specified in the program.
|
CASE.1 |
CASE.2 |
CASE.3 |
|---|---|---|
| Select the necessary soldering points for each product. | Only the specified points can be re-soldered. No need to modify the program. | In the event of an emergency stop or similar interruption, the process can be restarted from the stopped point. |
CASE.1
Different soldering requirements depending on product specifications
Select the necessary soldering points for each product.
CASE.2
Rework of defective areas such as unsoldered joints
Only the specified points can be re-soldered. No need to modify the program.
CASE.3
Resume after interruption of the program
In the event of an emergency stop or similar interruption, the process can be restarted from the stopped point.
Automatically calls up the appropriate program, preventing operator errors and improving work efficiency
20% performance increase compared to previous models.
HF-600 improves work efficiency for workpieces that were previously difficult or time-consuming.
TX1 (140 W), TX2 (300 W), TX3 (400 W) can be used interchangeably based on the workpiece.
The display shows the tip in use.
The rotating brush removes solder from the solder tip as well as flux carbide.
Countermeasure against solder ball and scatter of flux is equipped as standard. Solder wire diameter can be changed by simply replacing the pulley unit.
| Usable solder diameter |
|---|
| Φ0.3mm、0.5mm、0.6（0.65）mm、0.8mm、1mm、1.2mm、1.6mm |
Using of Φ0.3mm dia solder wire makes micro soldering possible.
Solder clogging and run-out can be detected with an optical sensor for solder movement.
