Products

Soldering pot/bath/Flow soldering system

HAKKO 485

HAKKO 485イメージ

Available in:

  • Japan
  • North America
  • Asia
  • Other Countries
  • LEAD FREE
  • Flow soldering pot that enables pin-point heating using nozzles matching components
  • Solder that blocks holes is removed by the air unit when components are dismounted
  • Compatible with lead-free solder
  • The impeller and chamber that are most easily corroded are plated with corrosion-resistant material
Contact Us
Catalog
Manuals / MSDS / Engineering documents
  • Features
  • Packaging List / Specifications
  • Soldering Tip / Nozzle
  • Replacement Parts / Option
  • Maintenance

Packing List

Part No. Packing List
No.485 Main unit, Air unit, 4 types of nozzle (485-N-01 - 04), 4 types of air hood (485-28 - 31), IC tweezers, Anti-oxidizer, Spatula, Lamp, Adapter, Foot switch
* Solder is not included.

仕様

Model No. 485
Power consumption 850W
Temperature range Normal temperature-299ºC
Molten solder capacity 10kg
Dimensions 500(W)×245(H)×550(D)mm
Weight 35kg

・Air Unit

Air pressure 196-686kPa (2-7kgf/cm2)
Dimensions 150(W)×100(H)×300(D)mm
Weight 3.5kg

* Weight (w/o solder)
* Solder is not included when factory setting.