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STORY 9: "Flow and Reflow"

Hikaru's diary on learning to solderHikaru's diary on learning to solder

STORY 9: Flow and Reflow

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Hikaru

Good morning.

Mr.Yokoo

Good morning, Hikaru. Have you become accustomed to the company?

Hikaru

Yes, I've become fairly accustomed to it.

Mr.Yokoo

I'm so glad to hear that.
By the way, I'll talk about various soldering methods today.

Hikaru

Soldering methods called "Reflow" and "Flow" that you mentioned before?

Mr.Yokoo

Yes. You have a good memory.
The number of electronic components used for P.W.B.s in electric products is very large. If these components are soldered one at a time, it takes a lot of time and the soldering cost is staggeringly high. Furthermore, labor of soldering workers who handle so many components is very large.

Hikaru

These seems somewhat interesting.

Mr.Yokoo

Making a single product may be interesting, but in the case of mass production, you can't say that.

Hikaru

Yes, you're right.

Mr.Yokoo

Today, I'll explain how to solder a large quantity of electronic components simultaneously.

Hikaru

It seems TV shopping or something like that.

Mr.Yokoo

That's crazy!

Hikaru

I'm sorry.

Mr.Yokoo

You really say a bit too much.
Soldering methods are generally classified into three types: "Iron soldering", "Dip soldering" and "Reflow soldering". You know about "Iron soldering", don't you?

Hikaru

Yes, of course.

Mr.Yokoo

The "Dip soldering method" is the method of dipping a target part into melted solder. The target part is directly heated with melted solder. It can be illustrated like this:

Dip soldering method