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Soldering Pot/Flow Soldering System

485

485
POINT
  • Flow soldering pot that enables pin-point heating using nozzles matching components
  • Solder that blocks holes is removed by the air unit when components are dismounted
  • Compatible with lead-free solder
  • The impeller and chamber that are most easily corroded are plated with corrosion-resistant material

Available in:

  • Japan
  • North America
  • Europe
  • Oceania
  • Asia
  • Other Countries

485

Specifications

Model No. 485
Power consumption 850 W
Temperature range Normal temperature to 300℃
Temperature stability ±2℃
Molten solder capacity 10 kg of Sb-Pb solder, about 9 kg of Pb-free solder
Dimensions 500 (W) × 245 (H) × 550 (D) mm
Weight 35 kg

 

Air Unit

Air supply pressure 0.196 to 0.686 Mpa (2 to 7 kgf/cm2)
Dimensions 150 (W) × 100 (H) × 300 (D) mm
Weight 3.5 kg
  • Weight is measured without solder and cord.
  • Solder is not included when factory setting.