Solder/Solder

HEXSOL

POINT

4 solder alloys to choose from, suitable for a variety of applications and requirements
Eutectic alloys available in both lead-free and leaded solders
Waste-free 1 m rolls
No-clean flux cored

Available in:

～ For more fun and comfortable soldering ～
The selected 4 solder alloys to suit a variety of applications and requirements are available

Characteristics of
eutectic solder

Pick the right size for the application.

Series	Alloy Type	Composition / Melting point	Φ0.3 ｍｍ	Φ0.6 ｍｍ	Φ0.8 ｍｍ	Φ1.0 ｍｍ	Φ1.2 ｍｍ	Φ1.6 ｍｍ
FS-511	Lead-free	Sn Cu 0.7% Ni 0.05% ・ 227℃(Eutectic)	〇	〇	〇	〇	〇	〇
FS-521	Lead-free	Sn Ag 3.0% Cu 0.5% ・ 217 to 220℃	〇	〇	〇	〇	〇	〇
FS-311	Leaded	Sn Pb 37% ・ 183℃(Eutectic)	〇	〇	〇	〇	〇	〇
FS-321	Leaded	Sn Pb 50% ・ 183 to 215℃	―	―	―	―	〇	〇

Solder melting point: The temperature range indicates the solidus and liquidus temperatures.
Solidus temperature：The temperature at which a solder begins to melt.
Liquidus temperature：The temperature at which a solder is completely melted.

The waste-free 1 m rolls allow for choosing the right solder, size, and quantity.

The use of no-clean flux with low corrosive properties does not require cleaning of the residue after soldering.

NEW	Product within 1 year after launch
LIMITED STOCK	Product which is available in some markets only and discontinued in others.
DISCONTINUED	Product discontinued already. The information in this page is based on the data when it was discontinued. No update/amendement will be added to the page.
	Product that complies with the regulated values of 10 substances prohibited by the european rohs directive.
	Based on the electrostatic attenuation test (MIL-STD-3010A Test method 4046), products with a charging voltage of 50V or less as being grounded are considered as ESD SAFE countermeasure products.
	Recommended for work using lead-free solder.