Soldering Pot/Flow Soldering System
- Compact flow soldering pot with high heat storage capacity
- Use of stainless steel for the table and double-layered structure prevents heat conduction
- North America
- Other Countries
Flow soldering pot/bath
Temperature control (normal temperature to 300°C)
Compact design with high heat storage capacity
Nozzles can not be used with this product.
Must oxides in the bath be removed?
If oxides accumulate inside the chamber in bath, the flow force becomes weak or a block of black oxides is discharged on the melted solder surface. Remove oxides periodically.