Products

Soldering Pot/Flow Soldering System

HAKKO 487

HAKKO 487イメージ

Available in:

  • Japan
  • North America
  • Compact flow soldering pot with high heat storage capacity
  • Use of stainless steel for the table and double-layered structure prevents heat conduction
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Catalog
Manuals / MSDS / Engineering documents
  • Features
  • Packaging List / Specifications
  • Soldering Tip / Nozzle
  • Replacement Parts / Option
  • Maintenance

Features

Flow soldering pot/bath
Temperature control (normal temperature to 300°C)
Compact design with high heat storage capacity
AttentionNozzles can not be used with this product.

Usage/Applications

Must oxides in the bath be removed?  
If oxides accumulate inside the chamber in bath, the flow force becomes weak or a block of black oxides is discharged on the melted solder surface. Remove oxides periodically.
Must oxides in the bath be removed?