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Solder Feeder/Solder Feed System


  • Compact, space-saving automatic solder feeder
  • V-groove put on solder surface reduces the splash of solder and flux
  • Feeding amount of solder can be controlled by turning the switch ON/OFF

Available in:

  • Japan
  • North America
  • Europe
  • Oceania
  • Asia
  • Other Countries


Optimal for minimizing solder and flux splash
Solder feeding equipment with V-grooving function for superior cost performance

Minimize solder and flux splash

As shown below, when solder is cut with a V-groove it enables the release of gas pressure generated by the flux, thereby suppressing splash.
However, because the V-groove exposes the flux to outside air the solder cannot be stored for a long period of time.
When using solder with the HAKKO 375, you can groove the solder that you require.

Minimize solder and flux splash

Advantages of V-grooved solder - Examination of solder/flux splash

Examination of solder/flux splash

Test criteria

Measurement method Measure the amount of solder and flux splashing after solder is fed to the soldering iron.
Temperature setting for soldering iron 350ºC and 400ºC
Solder Lead-free (Sn-3Ag-0.5Cu)
Halogen-free flux
Φ0.3 mm、Φ1.0 mm
Solder feed length 50 mm
  • The effect of solder and flux splashing prevention may differ under different operation conditions.

Measurement graph of flux splash amount

Applicable solder dia.

0.3mm, 0.5mm, 0.6mm, 0.8mm, 1.0mm dia.

Compact design


Can be applicable with the conventional solder reel stand.(Can be applicable with the HAKKO 611)

Application Examples

Can be applicable with the conventional solder reel stand.

Use an option switch to increase efficiency

Control the amount of solder that is fed using the ON/OFF switch. Use an option switch or hand switch to increase functionality even more.