Optimal for minimizing solder and flux splash
Solder feeding equipment with V-grooving function for superior cost performance

Minimize solder and flux splash

As shown below, when solder is cut with a V-groove it enables the release of gas pressure generated by the flux, thereby suppressing splash.
However, because the V-groove exposes the flux to outside air the solder cannot be stored for a long period of time.
When using solder with the HAKKO 375, you can groove the solder that you require.

Advantages of V-grooved solder - Examination of solder/flux splash

Test criteria

• The effect of solder and flux splashing prevention may differ under different operation conditions.

Measurement graph of flux splash amount

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  0.3 mm dia. solder*Click here to enlarge

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  1 mm dia. solder*Click here to enlarge

Applicable solder dia.

0.3 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1 mm dia.

Compact design

Usage/Applications

Can be applicable with the conventional solder reel stand.(Can be applicable with the HAKKO 611)

Application Examples

Use an option switch to increase efficiency

Control the amount of solder that is fed using the ON/OFF switch. Use an option switch or hand switch to increase functionality even more.