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Soldering Pot/Flow Soldering System

487

487
POINT
  • Compact flow soldering pot with high heat storage capacity
  • Use of stainless steel for the table and double-layered structure prevents heat conduction

Available in:

  • Japan
  • North America
  • Europe
  • Oceania
  • Asia
  • Other Countries

487

Flow soldering pot/bath

Temperature control (normal temperature to 300°C)

Compact design with high heat storage capacity

Nozzles can not be used with this product.

Usage/Applications

Must oxides in the bath be removed?

If oxides accumulate inside the chamber in bath, the flow force becomes weak or a block of black oxides is discharged on the melted solder surface. Remove oxides periodically.

Must oxides in the bath be removed?"