In addition to the utilization of multilayer boards for higher speed and higher integration of IC chip, the whole industry is shifting to lead-free solder with a high melting point for environmental reasons. However, against this background, many worksites suffer from a lack of power in devices such as soldering irons, hot-air rework system, etc.
But, if, the temperature setting for the soldering iron or hot-air rework system is increased due to this lack of power, there is a concern that the P.W.B. may be warped or that components with low heat resistance will be affected.
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