 |
| Mr.Yokoo |
: |
Hikaru, do you have a cellular phone? |
| Hikaru |
: |
Yes, I do. |
| Mr.Yokoo |
: |
Cellular phones have become considerably smaller
than those in the past. Why do you think they
have become so small? |
| Hikaru |
: |
Let me see, that's because
internal components have become smaller, P.W.B.
have become smaller, and the component-to-component
space has become smaller, too. Oh! Consequently,
the soldering tip must be smaller. |
| Mr.Yokoo |
: |
That's right.
But, if the soldering tip becomes smaller,
the amount of heat stored in the soldering
tip is reduced. As a result, the soldering
tip temperature rapidly lowers during soldering.
That's true all the more, because P.W.B.s
themselves have a multi-layer structure. It
is ideal that the soldering tip temperature
should not decrease even during soldering.
But, actually, this cannot be realized. Therefore,
we need soldering irons with high response
speed and excellent thermal recovery characteristics,
so that the soldering tip temperature can
be instantaneously restored to a preset temperature
in response to a drop in tip temperature. |
| Hikaru |
: |
This seems somewhat difficult. |
| Mr.Yokoo |
: |
In addition
to this, variety of soldering tip shape is
also required because the components mounted
to P.W.B.s have various shapes. |
| Hikaru |
: |
Well, then,
various soldering tips are required to re-touch
one PCB. |
| Mr.Yokoo |
: |
Yes.
We expect that soldering irons that provide
high response speed, excellent thermal recovery
characteristics and easy soldering tip replacement,
such as HAKKO
FX-951, will be in demand in the future.
|
| Hikaru |
: |
I see. Soldering
irons have rapidly advanced too. By the way,
how can we remove components with so many
leads and those without leads? |
| Mr.Yokoo |
: |
These components do have leads
at the back. Such components are called "BGA"
or "CSP".
The components with many leads can be removed
by using a special soldering tip, if they
are small. But QFP, BGA and CSP components
should be removed by using hot air. |
| Hikaru |
: |
Hot air? Does this mean "high-temperature
air"? |
| Mr.Yokoo |
: |
Our products,
HAKKO
FR-801, FR-802
and FR-803,
correspond to this.
Air is heated with a heater and blown onto
the lead to melt solder. The vacuum tweezers
(HAKKO 393 and HAKKO
394 jand A HAKKO
FR-803 pick up solder by vacuum. When
mounting the components, perform the reverse
procedure. |
| Hikaru |
: |
It's the same as reflow soldering,
isn't it? |
| Mr.Yokoo |
: |
Yes. |
|
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