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| Hikaru |
: |
Indeed, this
method can simultaneously solder all parts. |
| Mr.Yokoo |
: |
The container
that stores melted solder is called the "solder
pot" or "solder bath".
Our product, HAKKO96, corresponds to this.
But, HAKKO96 is generally used for pre-timming
of relatively small P.W.B.s and wiring.
For dip soldering, it is important to control
the temperature of solder in the bath, and
the concentration of impurities in the soldering
bath. Otherwise, metal in the patterns and
target parts will melt into the soldering
bath. The temperature of solder in the bath
is set about 30 to 80ºC higher than the
melting point. |
| Hikaru |
: |
I see. |
| Mr.Yokoo |
: |
But, this method
causes oxidization of the solder surface,
resulting in a soldering failure. |
| Hikaru |
: |
Oxidization? |
| Mr.Yokoo |
: |
Yes. In particular,
tin contained in the solder will be combined
with oxygen in the air.
To prevent oxidization, we must frequently
remove the oxide film on the solder surface.
The flow solder bath was devised so that the
solder surface remains free from the oxide
film.Flow soldering is the most popular method.
The principle of the flow
solder bath can be illlustrated like this.
|
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| Hikaru |
: |
Since the solder
is stirred with a pump, a new solder surface
constantly appears. |
| Mr.Yokoo |
: |
That's right.
Our product, HAKKO485, corresponds to this.
But, since the solder bath always has a new
solder surface, it will be oxidized one after
another. Consequently, the amount of resultant
oxide increases. |
| Hikaru |
: |
I see. This
method is useful. But, with this method the
surface mounting components will drop into
the solder bath, I guess. |
| Mr.Yokoo |
: |
Yes. The components
are fixed with adhesive before soldering.
But, to solder surface mounting components,
the reflow soldering method is generally used. |
| Hikaru |
: |
"Reflow"
and "Flow". These are somewhat confusing
terms. |
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